Advanced Design System (ADS) Update 2 - What's New

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<--Element not supported - Type: 8 Name: #comment--><--Element not supported - Type: 8 Name: #comment--> Request a Demo! Slideshow — What's New in ADS 2008 Update 2 What Has Been Added to ADS 2008 ADS 2008 Productivity Enhancements In the news: Agilent Technologies Announces Integrated, 3D EM Simulation Solution for RF Module Design Software Download: Visit this form to request a demo. ADS 2008 Update 2 is the latest in a series of releases in 2008 specifically targeted to double design productivity as measured in terms of reduction in: Simulation times Mouse clicks Activities needed to complete a design task RF modules in communications and consumer wireless products represent the fastest growing market segments for RF components. Helping you design these RF modules to hit competitive 3G and 4G market windows is the focus of ADS2008 Update 2 release. ADS 2008 Update 2 integrates full 3D EM simulation with enhanced capacity to enable the most efficient wireless RF module design. Get to know the exciting capabilities as follows: Full 3D EM simulation integrated in the ADS design flow doubles RF module design efficiency RF Modules RF modules consist of multi-layer dielectric materials typically implemented with Low Temperature Co-fired Ceramic (LTCC) or lower cost laminate technologies. They embed passive RF components such as spiral inductors, baluns, filters and meanders to reduce the size of the RF module through 3D stacking. Active devices such as RFICs can be connected on top of the stack through wirebonds or solder bumps. The completed structure is then usually wire bonded and enclosed in the popular Quad-Flat-No_lead (QFN) package that can be surface mounted onto PCB boards. Why full 3DEM integration is needed for RF module design The dielectric brick nature of RF module structure necessitates the use of full 3DEM simulation to account for the fringing effects at the edges of the dielectric layers which can lead to detuning of the embedded RF passive components. It is also needed to verify the effects of bond wires and package on the overall performance of the RF module against 3G and 4G wireless specifications through EM-circuit co-simulation. Planar 3DEM simulator such as Momentum has the advantage of speed over full 3DEM simulation for fast tuning and optimization but assumes infinite dielectric layers in its analysis. Doubling 3DEM co-simulation efficiency through ADS integration EMDS-for-ADS is the full 3DEM simulator integrated into ADS. It enables you to run full 3DEM co-simulation on your RF module with at least double efficiency over un-integrated EM tools because it eliminates the overhead of: Disrupting your design flow to use a separate standalone 3DEM simulator such as HFSS Learning a separate 3DEM tool Re-assigning material properties Re-inputting the design Importing and integrating 3DEM multi-port S-parameter data with active circuit elements for overall RF module simulation In a time study at Agilent Technologies Component Test (network analyzer) division, it takes an additional 2 hours per simulation run to use an un-integrated standalone 3DEM tool for doing EM-circuit co-simulation. Design input efficiency with parameterized 2D and 3D drawing components A large part of RF module design input involves drawing 2D embedded passive components such as spiral inductors and meander lines and 3D components such as connectors, packages, solder bumps and wire bonds. To speed you through the design input prior to running a 3DEM simulation, ADS now comes with parameterized 2D and 3D drawing components of the common structures found in RF modules. Component Level Design Rule Check (DRC) ensures error free physical design Unlike previous layer-based DRC where design rules are applied across the whole design, the new Component Level DRC allows different design rules to be applied selectively within components in a design. This means that embedded passive components within an RF module or active transistors in an MMIC can be precision checked for design rule compliance selectively to ensure error free output to manufacturing. ODB++ format for precision layout export to manufacturing ODB++ is becoming the de facto industry standard for data exchange in the PCB and assembly industry where a single ASCII database captures the PCB layout design, fabrication and assembly information.. ADS now supports ODB++ layout format export of RF PCB and module physical design for error free manufacturing.   ADS Transient-Convolution simulator overtakes leading SPICE simulators in speed and accuracy ADS Transient-Convolution simulator is now multi-threaded to take advantage of multi-core processors. E.g., a quad-core computer can deliver 3x speed up on top of the 6x speed improvement from the first ADS2008 platform release, giving you a total of 18x speed advantage. In recent customer conducted benchmarks against the 2 leading SPICE simulators, ADS Transient-Convolution consistently outperformed in both accuracy and speed. Accuracy in transient-convolution simulators is determined by how well the frequency-domain S-parameters generated from any passive network can be simulated in the time domain to match the direct transient simulation of the original network. Accuracy is achieved by Agilent EEsof’s patent pending technology of handling frequency-domain models in time-domain simulation with guaranteed passivity and causality. Fast interconnect design and modeling with ADS Transient-Convolution Simulator The complete confidence of achieving accurate transient simulation results from any combination of time- and frequency- domain models allows you to perform time-domain optimization to design and model high-speed or RF interconnects. The photo shows a chain of interconnects for a high-speed serial link. Its time-domain reflectometer (TDR) measurement reveals a direct time correlation of the signal behavior to the interconnect segment that the signal passed through. We can use this information to develop equivalent circuit models of the interconnects in a sequenced time-domain optimization. Click here to watch a clip of sequenced optimization(45s) Sequencing of optimization is a unique ADS platform capability which is used here to optimize the model of each interconnect section against its corresponding time segment of the measured TDR response. This cuts the time needed by an expert to hand-tune each interconnect model to match the overall TDR response from at least 2 days to 20 minutes. Verification of RF Modules to pass latest 3G and 4G wireless standards The wireless libraries in ADS represent the earliest availability of the latest 3G and 4G standards in simulate-able formats to enable designers of Agilent instruments and components to verify their designs efficiently. You can also use these wireless libraries to prove your RF modules for the latest 3G and 4G applications to achieve early design wins. Imagine without these libraries, even an expert would require at least 2 weeks to figure out thousands of pages of standards specification and to set them up for simulation and data processing. Now it is just a few convenient mouse clicks. Here is how easy it is to verify a design against the latest Mobile WiMax (802.16e) standard for power added efficiency (PAE) by simply connecting your design sub-circuit to the virtual instrument provided. Clicking on the instrument launches a series of WiMax compliance tests such as DC bias, power and frequency sweeps with time gating of the signal frame segments. ADS now also performs design verification against the latest 4G long term evolution (LTE) standard for wireless broadband internet with voice and other services on top. This downlink multiple input-multiple output (MIMO) technology exploits multiple signal paths through space time coding (STC) with 2 or 4 antennas to increase channel capacity. ADS 2008 Update 2 links with Antenna Modeling Design System (AMDS) for adaptive antenna matching RF module design AMDS is a dedicated 3DEM technology for efficiently simulating electrically large structures such as an antenna with its surrounding housing and human user as shown above. The antenna becomes detuned due to the changing proximity of the human hand and head while in use (blue trace). A technique to adaptively match the antenna is through the use of tunable ferroelectric capacitor based on barium-strontium-titanate (BST) thin-film technology. The AMDS to ADS link allows the adaptive tuning RF module to be designed and co-simulated with varying antenna characteristics to optimize the handset performance in its actual operating environment. Efficiently setup and simulate any combination of netlists and models to verify design robustness ADS 2008 UR2 adds the capability to sweep across any arbitrary combination of HSPICE©, Spectre or ADS netlists; and model types such as IBIS, measured and simulated data. The sweep combination can also be defined using convenient spreadsheet .csv files. This allows you to analyze your design when it is connected to changing external environments, e.g. your RF module with different packages or a motherboard with different types of memory module combinations from multiple suppliers. For a complete listing of all the capabilities in ADS2008 Update 2, please visit the What's been added in ADS 2008 page. Top of Page <--Element not supported - Type: 8 Name: #comment--><--Element not supported - Type: 8 Name: #comment--> eMule download:

界面好像稍微改进一些了

agilent的软件界面总是比较2